Infineon N Kanal, Effekt-MOSFET, 48 A 60 V Förbättring, 3 Ben, TO-220AB, HEXFET

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RS-artikelnummer:
919-4937
Tillv. art.nr:
IRFZ44EPBF
Tillverkare / varumärke:
Infineon
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Varumärke

Infineon

Kanaltyp

N

Produkttyp

Effekt-MOSFET

Maximal kontinuerlig dräneringsström (Id)

48 A

Maximal källspänning för dränering (Vds)

60 V

Kanalläge

Förbättring

Antal ben

3

Kapseltyp

TO-220AB

Serie

HEXFET

Fordonsstandard

Nej

Framåtriktad spänning (Vf)

1.3 V

Höjd

8.77 mm

Längd

10.54 mm

Maximal drain-källresistans (Rds)

0.023 Ω

Maximal spänning för grindkälla (Vgs)

-20 V, +20 V

Maximal arbetstemperatur

175 °C

Maximal effektförlust (Pd)

110 W

Minsta arbetsstemperatur

-55 °C

Typ av fäste

Genomgående hål

Standarder/godkännanden

ANSI Y14.5M, JEDEC TO-220AB

Typisk grindladdning (Qg) @ Vgs

60 nC

Bredd

4.69 mm

COO (ursprungsland):
CN

Infineon HEXFET Series MOSFET, 48A Maximum Continuous Drain Current, 110W Maximum Power Dissipation - IRFZ44EPBF


This MOSFET features an N-channel configuration, making it suitable for industrial and automation applications. It supports high continuous drain current, which is advantageous for power applications. Designed for enhanced efficiency, it is Ideal for electric and electronic systems where quick switching and durability are necessary.

Features & Benefits


• Continuous drain current capability up to 48A for effective operation

• Operates at a drain-source voltage of 60V for power management

• Low Rds(on) improves efficiency and reduces power loss

• Packaged in TO-220AB for straightforward installation and heat dissipation

• Fully avalanche rated, ensuring reliability under stress conditions

Applications


• Power supply circuits for increased efficiency

• Motor control in automation tasks

• DC-DC converters for voltage regulation

• High-performance battery management systems

• Electronic switching devices for enhanced control

What is the maximum gate-to-source voltage for safe operation?


The maximum gate-to-source voltage is ±20V, ensuring proper functionality and safety during operation.

How can this component be effectively mounted?


It is designed for through-hole mounting, facilitating a robust attachment to PCB layouts or heatsinks.

What happens if the device exceeds its maximum junction temperature?


Exceeding the maximum junction temperature of 175°C can result in thermal damage; therefore, proper cooling management is essential.

Can this be used in high-speed switching applications?


Yes, it supports fast switching capabilities, making it suitable for applications requiring Rapid signal processing.

What is the typical power dissipation capability at room temperature?


At 25°C, it can dissipate up to 110W, allowing it to handle substantial power flow without overheating.

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