Infineon IMLT65 Type N-Channel MOSFET, 68 A, 650 V Enhancement, 16-Pin PG-HDSOP-16 IMLT65R033M2HXTMA1
- RS-artikelnummer:
- 351-949
- Tillv. art.nr:
- IMLT65R033M2HXTMA1
- Tillverkare / varumärke:
- Infineon
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146,62 kr
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| 1 - 9 | 146,62 kr |
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*vägledande pris
- RS-artikelnummer:
- 351-949
- Tillv. art.nr:
- IMLT65R033M2HXTMA1
- Tillverkare / varumärke:
- Infineon
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 68A | |
| Maximum Drain Source Voltage Vds | 650V | |
| Output Power | 312W | |
| Package Type | PG-HDSOP-16 | |
| Series | IMLT65 | |
| Mount Type | Surface | |
| Pin Count | 16 | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 175°C | |
| Length | 10.1mm | |
| Width | 10.3 mm | |
| Standards/Approvals | JEDEC | |
| Height | 2.35mm | |
| Automotive Standard | No | |
| Välj alla | ||
|---|---|---|
Brand Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 68A | ||
Maximum Drain Source Voltage Vds 650V | ||
Output Power 312W | ||
Package Type PG-HDSOP-16 | ||
Series IMLT65 | ||
Mount Type Surface | ||
Pin Count 16 | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 175°C | ||
Length 10.1mm | ||
Width 10.3 mm | ||
Standards/Approvals JEDEC | ||
Height 2.35mm | ||
Automotive Standard No | ||
- COO (Country of Origin):
- MY
The Infineon CoolSiC MOSFET discrete Generation 2 (G2) in TOLT leverages the G2 best-in-class switching performance while enabling all the benefits of top-side cooling. Complementing the Q-DPAK package, it is now possible to implement a total discrete top-side cooling solution, obtaining better thermal performance, system cost reduction and simplification, and a cheaper assembly.
Enables BOM savings
Highest reliability
Enables top efficiency and power density
Simplifies assembly and cooling
Liquid cooling ready
Allows designs without fan or heatsink
Lower stray inductances
Better gate control
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