ROHM AG185FGD3HRB Type N-Channel Single MOSFETs, -40 V Enhancement, 3-Pin TO-252 (TL) AG185FGD3HRBTL

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27,12 kr

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33,90 kr

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RS-artikelnummer:
687-438
Tillv. art.nr:
AG185FGD3HRBTL
Tillverkare / varumärke:
ROHM
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Brand

ROHM

Product Type

Single MOSFETs

Channel Type

Type N

Maximum Drain Source Voltage Vds

-40V

Series

AG185FGD3HRB

Package Type

TO-252 (TL)

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

3.2mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

42nC

Maximum Gate Source Voltage Vgs

±20 V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

96W

Maximum Operating Temperature

175°C

Height

2.3mm

Width

6.80 mm

Length

10.50mm

Standards/Approvals

AEC-Q101, RoHS

Automotive Standard

AEC-Q101

COO (Country of Origin):
JP
The ROHM N channel power MOSFET designed for automotive applications. This device is tailored to provide efficient switching with a maximum drain-source voltage of 40V and a continuous drain current of 80A. It features a low on-resistance, ensuring minimal power loss during operation, which contributes to improved thermal management and performance in demanding environments. With a power dissipation capability of 96W, this MOSFET is suitable for various applications that require reliable and robust performance. Its Pb-free plating and RoHS compliance highlight 's commitment to environmentally friendly manufacturing. This part is AEC-Q101 qualified, ensuring it meets the stringent automotive standards for reliability and safety.

Low on resistance of 3.2mΩ maximises efficiency and reduces heat generation

Rated for a continuous drain current of 80A, suitable for robust applications

Provides a high power dissipation capability of 96W for demanding tasks

Designed for a maximum drain-source voltage of 40V ensuring versatility in applications

AEC Q101 qualified, ensuring high reliability in automotive use

Pb free plating and RoHS compliance reflect environmentally conscious production

Suitable for various automotive systems, enhancing system performance and longevity

Features a compact DPAK package for efficient space utilisation on PCB designs

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