TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 1.27 mm Pitch, 1 Row, Unshrouded

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2 934,14 kr

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3 667,68 kr

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RS-artikelnummer:
478-123
Distrelec artikelnummer:
304-50-850
Tillv. art.nr:
5-104178-5
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

1.27mm

Current

3.6A

Housing Material

Liquid Crystal Polymer

Number of Contacts

8

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Standards/Approvals

RoHS

Voltage

30 V

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is engineered for versatile board-to-board connections, optimising space and enhancing functionality in your projects. With a sleek vertical orientation, this component supports seamless integration in designs that prioritise efficiency. Featuring eight positions on a 1.27 mm centreline, it ensures a secure and stable connection while accommodating various applications in electronic assemblies. Constructed with high-quality materials, this unshrouded header is designed for through-hole soldering, guaranteeing a robust and durable attachment to printed circuit boards. Its excellent compatibility with AMPMODU System 50 exemplifies its adaptability, making it an ideal choice for modern electronics requiring reliable signal transmission.

Offers a parallel board-to-board configuration for increased layout flexibility

Designed with an operating temperature range that supports demanding environments

Facilitates high current delivery, ensuring robust performance in a compact form

Constructed from low halogen materials, contributing to environmentally friendly practices

Assures compatibility with both UL and CSA standards for trustworthy quality assurance

Includes a retention mechanism to enhance stability during operation

Supports a high insulation resistance value, ensuring minimal signal loss

Provides an efficient mating interface, enhancing connection security

Engineered for easy integration into various electronic applications

Available in bulk packaging for convenient procurement

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