TE Connectivity AMPMODU System 50 Series Vertical Board PCB Header, 80 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded

Subtotal (1 tube of 30 units)*

2 975,84 kr

(exc. VAT)

3 719,80 kr

(inc. VAT)

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  • Leverans från den 22 januari 2026
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Tube(s)
Per Tube
Per unit*
1 +2 975,84 kr99,195 kr

*price indicative

RS Stock No.:
498-284
Mfr. Part No.:
1-103916-6
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU System 50

Product Type

PCB Header

Current

3.6A

Pitch

1.27mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

80

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Tail Pin Length

2.54mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

30 V

Distrelec Product Id

304-48-110

Non Compliant

COO (Country of Origin):
US
The TE Connectivity PCB mount header represents a pinnacle of engineering designed for reliable board-to-board connections. Manufactured with precision, it features a compact and efficient configuration, making it an ideal choice for applications where space is at a premium. The vertical orientation accommodates 80 positions, ensuring optimal connectivity capabilities while maintaining a sleek profile. Its robust construction with quality materials guarantees durability and performance in demanding environments. The golden contacts further enhance conductivity, making this component suitable for high-frequency applications. With a 1.27 mm centreline pitch, it adheres to the highest industry standards while offering remarkable electrical and thermal characteristics. The product is equipped to withstand a wide range of temperatures, making it highly versatile across various industries, from telecommunications to automotive.

Boasts an unshrouded design for maximum flexibility in design

Enables through hole solder termination for enhanced stability

Constructed from LCP material for high temperature applications

Maintains a high insulation resistance to ensure signal integrity

Supporting a wide operating temperature range for diverse applications

Embraces a low halogen content for environmentally friendly compliance

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