TE Connectivity AMPMODU Series Vertical Board PCB Header, 10 Contact(s), 1.27 mm Pitch, 1 Row, Unshrouded

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Subtotal (1 pack of 150 units)*

2 723,62 kr

(exc. VAT)

3 404,52 kr

(inc. VAT)

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  • Leverans från den 22 januari 2026
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Pack(s)
Per Pack
Per unit*
1 +2 723,62 kr18,157 kr

*price indicative

RS Stock No.:
473-654
Mfr. Part No.:
5-104178-6
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

1.27mm

Current

3.6A

Housing Material

Liquid Crystal Polymer

Number of Contacts

10

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

1.27mm

Tail Pin Length

2.54mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

30 V

Distrelec Product Id

304-50-851

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is a versatile connector designed for board-to-board applications, featuring an intricate structure suitable for high-density environments. This component boasts an unshrouded design, allowing easy access for mating connections while maintaining a secure fit. With a vertical orientation and a 10-position configuration, it is optimised for tight spaces without compromising functionality. Its robust construction, crafted from high-quality materials, ensures reliable performance across a wide temperature range and various operating conditions. A perfect solution for modern electronic assemblies, this header offers enhanced reliability and efficiency, making it ideal for a wide spectrum of applications in the electronics industry.

Designed for ease of use in tight spaces

Efficiently accommodates high-density connections

Crafted from durable materials for long-lasting performance

Offers reliable connection integrity under various conditions

Optimised for compatibility with contemporary electronic systems

Enables straightforward mating with minimal alignment concerns

Provides excellent thermal and electrical stability in operation

Supports through-hole soldering for robust assembly

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