Infineon HEXFET Type N-Channel MOSFET, 5.2 A, 55 V Enhancement, 4-Pin SOT-223

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9 567,50 kr

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11 960,00 kr

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RS-artikelnummer:
168-8747
Tillv. art.nr:
IRLL2705TRPBF
Tillverkare / varumärke:
Infineon
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Brand

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

5.2A

Maximum Drain Source Voltage Vds

55V

Series

HEXFET

Package Type

SOT-223

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

65mΩ

Channel Mode

Enhancement

Maximum Power Dissipation Pd

2.1W

Typical Gate Charge Qg @ Vgs

32nC

Forward Voltage Vf

1.3V

Minimum Operating Temperature

-55°C

Maximum Gate Source Voltage Vgs

16 V

Maximum Operating Temperature

150°C

Standards/Approvals

No

Length

6.7mm

Width

3.7 mm

Height

1.739mm

Automotive Standard

No

COO (Country of Origin):
MY

Infineon HEXFET Series MOSFET, 5.2A Maximum Continuous Drain Current, 2.1W Maximum Power Dissipation - IRLL2705TRPBF


This high-performance MOSFET is designed for efficient power management across various applications. With an N-channel configuration, it provides excellent switching capabilities, making it suitable for tasks that require quick response and minimised energy loss. This component enhances the efficiency and reliability of electronic circuits, especially in automation and control systems.

Features & Benefits


• Maximum continuous drain current of 5.2A

• Drain-source voltage rating of 55V

• Low Rds(on) of 65mΩ for efficient operation

• Compact SOT-223 package for space-saving designs

Applications


• Ideal for power supply circuits

• Utilised in automotive power management systems

• Commonly employed for switching in high-frequency circuits

• Integrates well in power inverters for renewable energy systems

What is the maximum voltage this component can handle?


The product supports a maximum drain-source voltage of 55V, allowing for robust performance in various applications.

Can it operate at high temperatures?


Yes, it is rated for a maximum operating temperature of +150°C, ensuring reliability in challenging environments.

How does this component manage heat during operation?


With a maximum power dissipation of 2.1W, it effectively manages thermal performance, reducing the risk of overheating.

Is it compatible with standard PCB designs?


This component is suitable for surface mount technology, enabling easy integration into standard PCB layouts.

What makes this a suitable choice for automation projects?


Its Rapid switching capability and low on-resistance contribute to significant energy savings, enhancing the efficiency of automated systems.

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