Infineon, IGBT-modul 750 V, HybridPACK 6

Antal (1 fack med 6 enheter)*

32 971,818 kr

(exkl. moms)

41 214,774 kr

(inkl. moms)

Add to Basket
välj eller skriv kvantitet
Tillfälligt slut
  • Leverans från den 09 september 2026
Behöver du mer? Ange den kvantitet du behöver och klicka på "Kontrollera leveransdatum"
Enheter
Per enhet
Per fack*
6 +5 495,303 kr32 971,82 kr

*vägledande pris

RS-artikelnummer:
244-5877
Tillv. art.nr:
FS950R08A6P2BBPSA1
Tillverkare / varumärke:
Infineon
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla

Varumärke

Infineon

Produkttyp

IGBT-modul

Maximal kollektor-emitterspänning Vceo

750V

Maximal effektförlust Pd

870W

Antal transistorer

6

Kapseltyp

HybridPACK

Maximal spänning för gate-emitter VGEO

20 V

Minsta arbetsstemperatur

-40°C

Maximal mättnadsspänning för kollektorns emitter VceSAT

1.35V

Maximal arbetstemperatur

150°C

Standarder/godkännanden

RoHS, IEC24720 and IEC16022

Serie

FS950R08A6P2BBPSA1

Fordonsstandard

Nej

The infineon IGBT module drive is a very compact six-pack module (750 V/950 A) optimized for hybridand electric vehicles. The power module implements the new EDT2 IGBT generation, which is an automotive micro-pattern trench-field-stop cell design optimized for electric drive train applications. The chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation under harsh environmental conditions. The EDT2 IGBTs also show excellent light load power losses, which helps to improve system efficiency over a real driving cycle. The EDT2 IGBT was optimized for applications with switching frequencies in the range of 10 kHz.

Electrical Features

Blocking voltage 750 V

Low VCEsat

Low switching losses

Low Qg and crss

Low inductive design Tvj op = 150° C

Short-time extended operation temperature Tvj op = 175°C

Mechanical features

4.2kV DC 1sec insulation

High creepage and clearance distances

Compact design

High power density

Direct cooled pinFin base plate

Guiding elements for PCB and cooler assembly

Integrated NTC temperature sensor

Pressfit contact technology

RoHS compliant

UL 94 V0 module frame

Relaterade länkar