Silicon Labs EFR32FG25A111F1152IM56-B RF Transceiver IC, 56-Pin QFN-56
- RS-artikelnummer:
- 270-0501
- Tillv. art.nr:
- EFR32FG25A111F1152IM56-B
- Tillverkare / varumärke:
- Silicon Labs
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Enheter | Per enhet |
|---|---|
| 1 - 9 | 106,96 kr |
| 10 - 24 | 98,00 kr |
| 25 - 49 | 88,93 kr |
| 50 - 99 | 87,25 kr |
| 100 + | 80,19 kr |
*vägledande pris
- RS-artikelnummer:
- 270-0501
- Tillv. art.nr:
- EFR32FG25A111F1152IM56-B
- Tillverkare / varumärke:
- Silicon Labs
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Silicon Labs | |
| Technology | ARM Cortex | |
| Product Type | RF Transceiver IC | |
| Sub Type | Sub-GHz Wireless SoC | |
| Modulation Technique | FSK | |
| Package Type | QFN-56 | |
| Data Rate | 2530kHz | |
| Pin Count | 56 | |
| Mount Type | Surface | |
| Operating Band 1 Frequency | 470MHz | |
| Minimum Supply Voltage | 1.71V | |
| Operating Band 2 Frequency | 920MHz | |
| Maximum Supply Voltage | 3.8V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Series | EFR32FG25 | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Number of Operating Bands | 2 | |
| Välj alla | ||
|---|---|---|
Brand Silicon Labs | ||
Technology ARM Cortex | ||
Product Type RF Transceiver IC | ||
Sub Type Sub-GHz Wireless SoC | ||
Modulation Technique FSK | ||
Package Type QFN-56 | ||
Data Rate 2530kHz | ||
Pin Count 56 | ||
Mount Type Surface | ||
Operating Band 1 Frequency 470MHz | ||
Minimum Supply Voltage 1.71V | ||
Operating Band 2 Frequency 920MHz | ||
Maximum Supply Voltage 3.8V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Series EFR32FG25 | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
Number of Operating Bands 2 | ||
- COO (Country of Origin):
- TW
The Silicon Labs EFR32FG25 gecko SoC is an Ideal solution for sub-GHz Wi-SUN applications for metering, lighting, and distribution automation. The high-performance sub-GHz radio provides long range and is not susceptible to 2.4 GHz interference from technologies like Wi-Fi. The single die, multi-core solution, provides industry leading security, high throughput, and an integrated power amplifier to enable the next level of secure connectivity for IoT devices.
Integrated PA with up to 16 dBm (SubGHz) TX power
Robust peripheral set and up to 37 GPIO
Operation up to 125 °C
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