Silicon Labs EFR32FG25B121F1152IM56-B RF Transceiver IC, 56-Pin QFN-56
- RS-artikelnummer:
- 270-0511P
- Tillv. art.nr:
- EFR32FG25B121F1152IM56-B
- Tillverkare / varumärke:
- Silicon Labs
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1 379,00 kr
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Enheter | Per enhet |
|---|---|
| 10 - 24 | 110,32 kr |
| 25 - 49 | 101,58 kr |
| 50 - 99 | 99,57 kr |
| 100 + | 92,85 kr |
*vägledande pris
- RS-artikelnummer:
- 270-0511P
- Tillv. art.nr:
- EFR32FG25B121F1152IM56-B
- Tillverkare / varumärke:
- Silicon Labs
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Silicon Labs | |
| Technology | ARM Cortex | |
| Product Type | RF Transceiver IC | |
| Modulation Technique | FSK | |
| Data Rate | 2.4Mbps | |
| Package Type | QFN-56 | |
| Pin Count | 56 | |
| Mount Type | Surface | |
| Interface Type | I2C | |
| Operating Band 1 Frequency | 97.5MHz | |
| Minimum Supply Voltage | 1.71V | |
| Maximum Supply Voltage | 3.8V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS | |
| Height | 0.85mm | |
| Series | Gecko | |
| Width | 7 mm | |
| Length | 7mm | |
| Automotive Standard | No | |
| Välj alla | ||
|---|---|---|
Brand Silicon Labs | ||
Technology ARM Cortex | ||
Product Type RF Transceiver IC | ||
Modulation Technique FSK | ||
Data Rate 2.4Mbps | ||
Package Type QFN-56 | ||
Pin Count 56 | ||
Mount Type Surface | ||
Interface Type I2C | ||
Operating Band 1 Frequency 97.5MHz | ||
Minimum Supply Voltage 1.71V | ||
Maximum Supply Voltage 3.8V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS | ||
Height 0.85mm | ||
Series Gecko | ||
Width 7 mm | ||
Length 7mm | ||
Automotive Standard No | ||
- COO (Country of Origin):
- TW
The Silicon Labs EFR32FG25 gecko SoC is an Ideal solution for sub-GHz Wi-SUN applications for metering, lighting, and distribution automation. The high-performance sub-GHz radio provides long range and is not susceptible to 2.4 GHz interference from technologies like Wi-Fi. The single die, multi-core solution, provides industry leading security, high throughput, and an integrated power amplifier to enable the next level of secure connectivity for IoT devices.
Integrated PA with up to 16 dBm (SubGHz) TX power
Robust peripheral set and up to 37 GPIO
Operation up to 125 °C
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