CTS, 74X 4.7kΩ ±5% Bussed Resistor Array, 8 Resistors, 0.063W total, 6431, Concave
- RS-artikelnummer:
- 179-0290
- Tillv. art.nr:
- 745C101472JP
- Tillverkare / varumärke:
- CTS
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- RS-artikelnummer:
- 179-0290
- Tillv. art.nr:
- 745C101472JP
- Tillverkare / varumärke:
- CTS
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | CTS | |
| Resistance | 4.7kΩ | |
| Resistor Type | Array | |
| Number of Resistors | 8 | |
| Package/Case | 6431 | |
| Power Rating | 0.063W | |
| Termination Style | Concave | |
| Tolerance | ±5% | |
| Case Style | Moulded | |
| Power Rating per Resistor | 0.063W | |
| Circuit Designator | BUS | |
| Length | 6.4mm | |
| Depth | 3.2mm | |
| Height | 0.7mm | |
| Dimensions | 6.4 x 3.2 x 0.7mm | |
| Number of Terminals | 10 | |
| Series | 74X | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +125°C | |
| Temperature Coefficient | ±200ppm/°C | |
| Välj alla | ||
|---|---|---|
Brand CTS | ||
Resistance 4.7kΩ | ||
Resistor Type Array | ||
Number of Resistors 8 | ||
Package/Case 6431 | ||
Power Rating 0.063W | ||
Termination Style Concave | ||
Tolerance ±5% | ||
Case Style Moulded | ||
Power Rating per Resistor 0.063W | ||
Circuit Designator BUS | ||
Length 6.4mm | ||
Depth 3.2mm | ||
Height 0.7mm | ||
Dimensions 6.4 x 3.2 x 0.7mm | ||
Number of Terminals 10 | ||
Series 74X | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +125°C | ||
Temperature Coefficient ±200ppm/°C | ||
- COO (Country of Origin):
- JP
74x Series Chip Arrays are single packaged devices containing an array of homogeneous resistor elements. Arrays are typically used for convenience when several resistors occupy the same area in a layout. Multiple package sizes and circuit configurations help save placement costs by reducing application component count.
Low Cost Thick Film Technology
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs