CTS, 74X 220Ω ±5% Isolated Resistor Array, 8 Resistors, 0.063W total, 0603 (1608M), Concave
- RS-artikelnummer:
- 179-0249
- Tillv. art.nr:
- 742C163221JP
- Tillverkare / varumärke:
- CTS
Inte tillgänglig
RS kommer inte längre att lagerföra denna produkt.
- RS-artikelnummer:
- 179-0249
- Tillv. art.nr:
- 742C163221JP
- Tillverkare / varumärke:
- CTS
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | CTS | |
| Resistance | 220Ω | |
| Number of Resistors | 8 | |
| Resistor Type | Array | |
| Package/Case | 0603 (1608M) | |
| Power Rating | 0.063W | |
| Termination Style | Concave | |
| Tolerance | ±5% | |
| Case Style | Moulded | |
| Power Rating per Resistor | 0.063W | |
| Circuit Designator | ISOL | |
| Length | 6.4mm | |
| Depth | 1.6mm | |
| Height | 0.7mm | |
| Dimensions | 6.4 x 1.6 x 0.7mm | |
| Series | 74X | |
| Number of Terminals | 16 | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +125°C | |
| Temperature Coefficient | ±200ppm/°C | |
| Välj alla | ||
|---|---|---|
Brand CTS | ||
Resistance 220Ω | ||
Number of Resistors 8 | ||
Resistor Type Array | ||
Package/Case 0603 (1608M) | ||
Power Rating 0.063W | ||
Termination Style Concave | ||
Tolerance ±5% | ||
Case Style Moulded | ||
Power Rating per Resistor 0.063W | ||
Circuit Designator ISOL | ||
Length 6.4mm | ||
Depth 1.6mm | ||
Height 0.7mm | ||
Dimensions 6.4 x 1.6 x 0.7mm | ||
Series 74X | ||
Number of Terminals 16 | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +125°C | ||
Temperature Coefficient ±200ppm/°C | ||
- COO (Country of Origin):
- JP
74x Series Chip Arrays are single packaged devices containing an array of homogeneous resistor elements. Arrays are typically used for convenience when several resistors occupy the same area in a layout. Multiple package sizes and circuit configurations help save placement costs by reducing application component count.
Low Cost Thick Film Technology
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs