Molex PCB Header 8-Position, 53988-0619
- RS-artikelnummer:
- 520-592
- Tillv. art.nr:
- 53988-0619
- Tillverkare / varumärke:
- Molex
Antal (1 förpackning med 30 enheter)*
2 028,54 kr
(exkl. moms)
2 535,68 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
Tillfälligt slut
- Leverans från den 26 januari 2026
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Förpackning(ar) | Per förpackning | Per enhet* |
|---|---|---|
| 1 + | 2 028,54 kr | 67,618 kr |
*vägledande pris
- RS-artikelnummer:
- 520-592
- Tillv. art.nr:
- 53988-0619
- Tillverkare / varumärke:
- Molex
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Molex | |
| Type | PCB Header | |
| Body Orientation | Vertical | |
| Number of Contacts | 8 | |
| Contact Material | Tin | |
| Välj alla | ||
|---|---|---|
Brand Molex | ||
Type PCB Header | ||
Body Orientation Vertical | ||
Number of Contacts 8 | ||
Contact Material Tin | ||
- COO (Country of Origin):
- JP
The TE Connectivity C-Grid header represents innovative design and engineering excellence, ideal for high-temperature applications. Crafted with precision, this high-performance component features a dual-row, through-hole configuration that simplifies PCB integration while ensuring reliable signal transmission. With eight circuits, it is designed for versatility in various wire-to-board applications. The header's tin plating enhances conductivity and durability, making it a dependable choice for PCB headers and receptacles. Its high-temperature thermoplastic construction guarantees resilience under challenging operational conditions, while the thoughtful design allows for secure and faultless mating with compatible parts. Experience confidence in your connectivity with this robust solution, engineered to meet the rigorous demands of modern electronic systems.
Dual-row configuration enhances space efficiency on PCBs
Constructed from high-temperature materials for reliability
Tin plating provides superior conductivity and corrosion resistance
Designed for ease of assembly in various applications
Fully shrouded design ensures secure mating and protection against misalignment
Compliant with industry standards, ensuring a reliable connection
Lightweight construction optimises overall designs without compromising strength
Offers flexibility for a variety of signal and power needs
Constructed from high-temperature materials for reliability
Tin plating provides superior conductivity and corrosion resistance
Designed for ease of assembly in various applications
Fully shrouded design ensures secure mating and protection against misalignment
Compliant with industry standards, ensuring a reliable connection
Lightweight construction optimises overall designs without compromising strength
Offers flexibility for a variety of signal and power needs
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