Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Bulk discount available

Subtotal (1 pack of 5 units)*

158,25 kr

(exc. VAT)

197,80 kr

(inc. VAT)

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  • Dessutom levereras 1 600 enhet(er) från den 15 december 2025
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Units
Per unit
Per Pack*
5 - 9531,65 kr158,25 kr
100 - 37025,11 kr125,55 kr
375 - 149524,08 kr120,40 kr
1500 - 299523,14 kr115,70 kr
3000 +22,22 kr111,10 kr

*price indicative

Packaging Options:
RS Stock No.:
670-2137
Mfr. Part No.:
43650-0225
Brand:
Molex
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Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Housing Material

High Temperature Thermoplastic

Number of Contacts

2

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3mm

Maximum Operating Temperature

125°C

Contact Gender

Male

Standards/Approvals

No

Voltage

250 V

Distrelec Product Id

304-42-704

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series


Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Solder tabs for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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