Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 10 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Mängdrabatt möjlig

Antal (1 förpackning med 5 enheter)*

214,22 kr

(exkl. moms)

267,775 kr

(inkl. moms)

Add to Basket
välj eller skriv kvantitet
Tillfälligt slut
  • Leverans från den 20 april 2026
Behöver du mer? Ange den kvantitet du behöver och klicka på "Kontrollera leveransdatum"
Enheter
Per enhet
Per förpackning*
5 - 9542,844 kr214,22 kr
100 - 37034,452 kr172,26 kr
375 - 149530,172 kr150,86 kr
1500 - 299524,886 kr124,43 kr
3000 +23,274 kr116,37 kr

*vägledande pris

Förpackningsalternativ:
RS-artikelnummer:
670-2235
Tillv. art.nr:
43650-1025
Tillverkare / varumärke:
Molex
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla

Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Number of Contacts

10

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Gold

Row Pitch

3mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

125°C

Standards/Approvals

No

Voltage

250 V

Distrelec Product Id

304-62-235

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series


Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Solder tabs for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


relaterade länkar