Molex Micro-Fit Series Right Angle Through Hole PCB Header, 8 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS-artikelnummer:
- 205-1062
- Tillv. art.nr:
- 212528-0800
- Tillverkare / varumärke:
- Molex
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- RS-artikelnummer:
- 205-1062
- Tillv. art.nr:
- 212528-0800
- Tillverkare / varumärke:
- Molex
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Molex | |
| Series | Micro-Fit | |
| Product Type | PCB Header | |
| Pitch | 3mm | |
| Current | 12.5A | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 8 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 3mm | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | No | |
| Voltage | 600 V | |
| Välj alla | ||
|---|---|---|
Brand Molex | ||
Series Micro-Fit | ||
Product Type PCB Header | ||
Pitch 3mm | ||
Current 12.5A | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 8 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Tin | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 3mm | ||
Contact Gender Female | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals No | ||
Voltage 600 V | ||
- COO (Country of Origin):
- CN
The Molex Micro-Fit+ connector is a wire-to-board system which offers a 3.00mm pitch, a higher-current rating of 12.5A and superior design options for flexibility and efficient assembly. It is used in routers, appliances and charging stations.
Fully isolated contacts on each side of the interface
Prevents mis-mating; different than standard Micro-Fit 3.0
Enhanced TPA design
V-0/Glow Wire combination resin
Reflow options available
Reduced Mating Force by 40%
Smaller PCB footprint
Fully polarized housings
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