Molex Micro-Fit Series Right Angle Through Hole PCB Header, 8 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS-artikelnummer:
- 205-1061
- Tillv. art.nr:
- 212528-0800
- Tillverkare / varumärke:
- Molex
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- RS-artikelnummer:
- 205-1061
- Tillv. art.nr:
- 212528-0800
- Tillverkare / varumärke:
- Molex
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Molex | |
| Series | Micro-Fit | |
| Product Type | PCB Header | |
| Pitch | 3mm | |
| Current | 12.5A | |
| Number of Contacts | 8 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Copper Alloy | |
| Termination Type | Solder | |
| Row Pitch | 3mm | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Contact Gender | Female | |
| Standards/Approvals | No | |
| Voltage | 600 V | |
| Välj alla | ||
|---|---|---|
Brand Molex | ||
Series Micro-Fit | ||
Product Type PCB Header | ||
Pitch 3mm | ||
Current 12.5A | ||
Number of Contacts 8 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Copper Alloy | ||
Termination Type Solder | ||
Row Pitch 3mm | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Contact Gender Female | ||
Standards/Approvals No | ||
Voltage 600 V | ||
- COO (Country of Origin):
- CN
The Molex Micro-Fit+ connector is a wire-to-board system which offers a 3.00mm pitch, a higher-current rating of 12.5A and superior design options for flexibility and efficient assembly. It is used in routers, appliances and charging stations.
Fully isolated contacts on each side of the interface
Prevents mis-mating; different than standard Micro-Fit 3.0
Enhanced TPA design
V-0/Glow Wire combination resin
Reflow options available
Reduced Mating Force by 40%
Smaller PCB footprint
Fully polarized housings
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