TE Connectivity AMPMODU System 50 Series Straight Surface PCB Header, 40 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded
- RS-artikelnummer:
- 164-4173
- Tillv. art.nr:
- 5-104549-6
- Tillverkare / varumärke:
- TE Connectivity
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- RS-artikelnummer:
- 164-4173
- Tillv. art.nr:
- 5-104549-6
- Tillverkare / varumärke:
- TE Connectivity
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | TE Connectivity | |
| Series | AMPMODU System 50 | |
| Product Type | PCB Header | |
| Current | 1A | |
| Pitch | 1.27mm | |
| Number of Contacts | 40 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board, Wire-to-Board | |
| Mount Type | Surface | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | No | |
| Voltage | 40 V | |
| Distrelec Product Id | 304-50-862 | |
| Välj alla | ||
|---|---|---|
Brand TE Connectivity | ||
Series AMPMODU System 50 | ||
Product Type PCB Header | ||
Current 1A | ||
Pitch 1.27mm | ||
Number of Contacts 40 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board, Wire-to-Board | ||
Mount Type Surface | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals No | ||
Voltage 40 V | ||
Distrelec Product Id 304-50-862 | ||
- COO (Country of Origin):
- US
TE Connectivity 1.27mm x 2.54mm AMPMODU System 50 Board to Board Headers
AMPMODU System 50 1.27 x 2.54mm shrouded and unshrouded board to board PCB header connectors with a high density design for PCB space saving. The housings of these AMPMODU System 50 1.27 x 2.54mm headers are made from high termperature thermoplastic with a polarized design to aid alignment to mating connectors and stand-offs for drainage. The unshrouded versions of these AMPMODU System 50 headers allow for the close stacking of daughter cards. These AMPMODU System 50 1.27 x 2.54mm board to board headers are available in a variety of configurations, single row, double row, vertical, right angle, through hole and SMT
Part numbers x-104074-x and x-104069-x have solder clips / PCB hold down posts.
TE Connectivity AMPMODU System 50 Interconnection System
AMPMODU System 50 Interconnection System with a compact space saving design and high density 1.27 x 2.54 mm contact spacing for use in high density applications. The AMPMODU System 50 connector system consists of PCB headers, PCB receptacles and wire to board IDC ribbon cable connectors. These connectors are available in various configurations making the AMPMODU System 50 connector system suitable for a wide range of applications. The contacts of the AMPMODU System 50 connectors are made from high conductivity copper alloy with selective gold plating for high electrical performance and reliability.
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