TE Connectivity AMPMODU System 50 Series Vertical Board PCB Header, 40 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

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Antal (1 rör med 32 enheter)*

3 624,66 kr

(exkl. moms)

4 530,82 kr

(inkl. moms)

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RS-artikelnummer:
474-233
Tillv. art.nr:
104549-6
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU System 50

Pitch

1.27mm

Current

1A

Number of Contacts

40

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board, Wire-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Contact Gender

Male

Standards/Approvals

CSA LR7189, UL E28476

Voltage

30 V

Distrelec Product Id

304-53-638

Uppfyller ej RoHS

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is designed for both board-to-board and wire-to-board applications, offering unparalleled versatility and reliability. With a fully shrouded design and a 40-position configuration, it ensures a stable connection with a secure fit. Crafted from high-quality thermoplastic, it withstands a broad range of operating temperatures, making it suitable for various industrial environments. The connector features gold-plated contacts for optimal conductivity, ensuring minimal signal loss. Its standout characteristics, including a vertical mounting orientation and a compact 1.27 mm pitch, make it an ideal choice for space-constrained applications. Whether you're developing complex electronic systems or simple connectors, this product will enhance performance and reliability in any project.

Provides secure and stable connections in challenging environments

Designed for both surface mount and versatile applications

Matte finished contact termination area enhances durability

Low halogen composition contributes to environmental safety

Geared for seamless integration in high performance electronic configurations

Compact design allows for efficient space management on PCBs

Includes mating retention features for increased reliability

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