Samtec UDM6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 1 Row, Shrouded

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331,66 kr

(exkl. moms)

414,58 kr

(inkl. moms)

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RS-artikelnummer:
644-469
Tillv. art.nr:
UDM6-40-4-01.5-L-A-TH-TR
Tillverkare / varumärke:
Samtec
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Brand

Samtec

Product Type

PCB Header

Series

UDM6

Pitch

0.635mm

Current

15A

Number of Contacts

240

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Plating

Gold, Tin

Contact Material

Copper Alloy

Minimum Operating Temperature

-55°C

Row Pitch

0.635mm

Termination Type

Solder

Tail Pin Length

1.5mm

Maximum Operating Temperature

125°C

Standards/Approvals

PCIe 6.0/CXL 3.1 Capable, PCI-SIG

The Samtec 0.635 mm Socket is a AcceleRate mP high-density, high-speed power/signal socket which delivers industry leading performance with a compact 5 mm profile with 10 mm and 16 mm stack heights in development. It supports up to 8 power blades and 240 signal positions with higher counts coming soon, utilizes rotated power blades for enhanced cooling and simplified breakout routing, and features an open-pin-field design for routing and grounding flexibility. Engineered for high-speed applications, it delivers 64 Gbps PAM4 and is PCIe 6.0/CXL 3.1 capable, with alignment pins, polarized guide posts, and weld tabs included for secure mating and board retention.

Best in class density for power and signal

Rotated power blades improve performance and simplify breakout region

Open-pin-field design for routing and grounding flexibility

Polarized guide posts for blind mating

Optional alignment pins

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