Samtec UDM6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 1 Row, Shrouded
- RS-artikelnummer:
- 644-468
- Tillv. art.nr:
- UDM6-10-2-01.5-L-A-TH-TR
- Tillverkare / varumärke:
- Samtec
Mängdrabatt möjlig
Antal (1 enhet)*
175,92 kr
(exkl. moms)
219,90 kr
(inkl. moms)
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- Dessutom levereras 119 enhet(er) från den 28 januari 2026
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Enheter | Per enhet |
|---|---|
| 1 - 9 | 175,92 kr |
| 10 + | 161,84 kr |
*vägledande pris
- RS-artikelnummer:
- 644-468
- Tillv. art.nr:
- UDM6-10-2-01.5-L-A-TH-TR
- Tillverkare / varumärke:
- Samtec
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Samtec | |
| Series | UDM6 | |
| Product Type | PCB Header | |
| Current | 15A | |
| Pitch | 0.635mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 240 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Contact Plating | Gold, Tin | |
| Contact Material | Copper Alloy | |
| Termination Type | Solder | |
| Row Pitch | 0.635mm | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 125°C | |
| Tail Pin Length | 1.5mm | |
| Standards/Approvals | PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | |
| Voltage | 283 V | |
| Välj alla | ||
|---|---|---|
Brand Samtec | ||
Series UDM6 | ||
Product Type PCB Header | ||
Current 15A | ||
Pitch 0.635mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 240 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Contact Plating Gold, Tin | ||
Contact Material Copper Alloy | ||
Termination Type Solder | ||
Row Pitch 0.635mm | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 125°C | ||
Tail Pin Length 1.5mm | ||
Standards/Approvals PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | ||
Voltage 283 V | ||
The Samtec 0.635 mm Socket is a AcceleRate mP high-density, high-speed power/signal socket which delivers industry leading performance with a compact 5 mm profile with 10 mm and 16 mm stack heights in development. It supports up to 8 power blades and 240 signal positions with higher counts coming soon, utilizes rotated power blades for enhanced cooling and simplified breakout routing, and features an open-pin-field design for routing and grounding flexibility. Engineered for high-speed applications, it delivers 64 Gbps PAM4 and is PCIe 6.0/CXL 3.1 capable, with alignment pins, polarized guide posts, and weld tabs included for secure mating and board retention.
Best in class density for power and signal
Rotated power blades improve performance and simplify breakout region
Open-pin-field design for routing and grounding flexibility
Polarized guide posts for blind mating
Optional alignment pins
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