TE Connectivity AMPMODU Headers Series Vertical Board PCB Header, 1 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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14 570,61 kr

(exkl. moms)

18 213,26 kr

(inkl. moms)

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RS-artikelnummer:
505-907
Tillv. art.nr:
5-146861-1
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU Headers

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

1

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Termination Type

Solder

Contact Gender

Male

Tail Pin Length

2.92mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header offers a sophisticated solution for your board-to-board connectivity needs. Designed with a vertical orientation, this connector ensures a reliable electrical connection with minimal space usage, making it ideal for compact applications. Its breakaway feature enhances flexibility during assembly while maintaining a secure fit in the PCB. The connector is constructed with durable thermoplastic material, ensuring longevity and resistance to high temperatures. With a gold-plated contact area, this connector provides maximum conductivity, while its through-hole solder termination method guarantees a robust installation. Proven in various applications, the PCB Mount Header stands out for its compatibility and efficacy among modern electronic designs.

Optimised for vertical mounting, enhancing spatial efficiency

Breakaway design facilitates easy assembly and removal

Constructed from high-quality thermoplastic for durability

Gold plating ensures superior electrical conductivity

Rated for operating temperatures between -65 and 105 °C

Pin-in-paste capability allows for streamlined soldering processes

Suitable for both commercial and industrial applications

Supports high-density designs without compromising performance

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