TE Connectivity AMPMODU Headers, 2.54 mm Avstånd, 1-polen med 2 Rader Vertikal Kretskortsstiftlist, Styrelsen Utan hölje

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14 570,61 kr

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18 213,26 kr

(inkl. moms)

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RS-artikelnummer:
505-907
Tillv. art.nr:
5-146861-1
Tillverkare / varumärke:
TE Connectivity
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Varumärke

TE Connectivity

Produkttyp

Kretskortsstiftlist

Serie

AMPMODU Headers

Delning

2.54mm

Ström

3A

Husmaterial

Termoplast

Antal kontakter

1

Antal rader

2

Orientering

Vertikal

Skyddat/icke-skyddat

Utan hölje

Kontaktdonssystem

Kort-till-kort

Typ av fäste

Styrelsen

Kontaktmaterial

Kopparlegering

Kontaktplätering

Guld

Termineringstyp

Lödning

Radpitch

2.54mm

Minsta arbetsstemperatur

65°C

Kontakthane/hona

Hane

Svanspinlängd

2.92mm

Maximal arbetstemperatur

105°C

Standarder/godkännanden

CSA LR7189, UL 94V-0, UL E28476

COO (ursprungsland):
MX
The TE Connectivity PCB Mount Header offers a sophisticated solution for your board-to-board connectivity needs. Designed with a vertical orientation, this connector ensures a reliable electrical connection with minimal space usage, making it ideal for compact applications. Its breakaway feature enhances flexibility during assembly while maintaining a secure fit in the PCB. The connector is constructed with durable thermoplastic material, ensuring longevity and resistance to high temperatures. With a gold-plated contact area, this connector provides maximum conductivity, while its through-hole solder termination method guarantees a robust installation. Proven in various applications, the PCB Mount Header stands out for its compatibility and efficacy among modern electronic designs.

Optimised for vertical mounting, enhancing spatial efficiency

Breakaway design facilitates easy assembly and removal

Constructed from high-quality thermoplastic for durability

Gold plating ensures superior electrical conductivity

Rated for operating temperatures between -65 and 105 °C

Pin-in-paste capability allows for streamlined soldering processes

Suitable for both commercial and industrial applications

Supports high-density designs without compromising performance

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