TE Connectivity AMPMODU, 2.54 mm Avstånd, 14-polen med 2 Rader Vertikal Kretskortsstiftlist, Styrelsen Utan hölje

Antal (1 förpackning med 65 enheter)*

2 243,77 kr

(exkl. moms)

2 804,71 kr

(inkl. moms)

Add to Basket
välj eller skriv kvantitet
Lagerförs av tillverkaren
  • Redo att levereras från 04 maj 2026 den
Behöver du mer? Ange den kvantitet du behöver och klicka på "Kontrollera leveransdatum"
Förpackning(ar)
Per förpackning
Per enhet*
1 +2 243,77 kr34,52 kr

*vägledande pris

RS-artikelnummer:
505-894
Tillv. art.nr:
5-146256-7
Tillverkare / varumärke:
TE Connectivity
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla

Varumärke

TE Connectivity

Serie

AMPMODU

Produkttyp

Kretskortsstiftlist

Ström

3A

Delning

2.54mm

Antal kontakter

14

Husmaterial

Termoplast

Antal rader

2

Orientering

Vertikal

Skyddat/icke-skyddat

Utan hölje

Kontaktdonssystem

Kort-till-kort

Typ av fäste

Styrelsen

Kontaktplätering

Guld

Kontaktmaterial

Fosforbrons

Termineringstyp

Lödning

Radpitch

2.54mm

Minsta arbetsstemperatur

65°C

Svanspinlängd

3.05mm

Maximal arbetstemperatur

105°C

Standarder/godkännanden

No

COO (ursprungsland):
US
The TE Connectivity PCB Mount Header is a premium connectivity solution designed for board-to-board applications. Its vertical orientation and breakaway feature provide exceptional versatility for various configurations, making it ideal for modern electronic devices. With 14 positions and a compact 2.54 mm centreline, it accommodates high-density connectivity needs without compromising performance. The combination of gold contact plating and nickel underplating ensures reliable electrical performance and longevity, while its thermoplastic housing withstands challenging operating conditions. Designed for ease of integration, this connector promises to elevate your project with its robust and dependable design.

Vertical orientation enhances space efficiency in PCB layouts

Breakaway design allows for flexible assembly options

Accommodates up to 14 positions, suitable for compact applications

Gold plating ensures superior conductivity and corrosion resistance

Nickel underplating adds durability and reliability

Thermoplastic housing offers protection against environmental factors

Compatible with high-density circuit designs, ensuring versatility

Easily integrates into existing systems for seamless upgrades

Designed for through-hole solder termination, simplifying installation

Robust mechanical attachment supports secure and stable connections

Relaterade länkar