TE Connectivity AMPMODU Headers Series Vertical Board PCB Header, 9 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

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2 825,41 kr

(exkl. moms)

3 531,76 kr

(inkl. moms)

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RS-artikelnummer:
505-888
Tillv. art.nr:
5-146128-7
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU Headers

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Housing Material

Copper Alloy

Number of Contacts

9

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Termination Type

Surface Mount

Tail Pin Length

2.29mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LE7189, UL E28476

Voltage

30 V

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is designed for vertical integration in board-to-board applications, offering a robust solution with nine positions and a 2.54 mm centreline. Engineered for seamless connectivity, it features a breakaway design that facilitates efficient assembly and enhances adaptability in various configurations. Built with high-quality materials, including gold underplating and nickel contact bases, this connector ensures reliable performance even in demanding environments. The advanced housing material is optimally rated for high temperatures, making it suitable for a wide range of applications. With an operating voltage of up to 30 VAC, this connector provides a dependable solution for signal transmission in electronic circuits, ensuring uninterrupted operation and longevity in critical applications.

Robust build quality ensures long-lasting performance under various environmental conditions

Compact design allows for efficient use of space on printed circuit boards

Breakaway feature provides flexibility in assembly and configuration

Meets industry standards for safety and compatibility, offering peace of mind to users

LCP housing material enhances durability and thermal resistance

Pin-in-paste capable for streamlined soldering and assembly processes

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