TE Connectivity AMPMODU Series Vertical Board PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

Subtotal (1 pack of 150 units)*

2 655,41 kr

(exc. VAT)

3 319,26 kr

(inc. VAT)

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  • Leverans från den 22 januari 2026
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Pack(s)
Per Pack
Per unit*
1 +2 655,41 kr17,703 kr

*price indicative

RS Stock No.:
480-993
Mfr. Part No.:
5-146254-7
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

14

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Tin Plated

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.05mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Distrelec Product Id

304-50-874

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header offers a robust solution for board-to-board connectivity, ideal for demanding electronic applications. Designed with a vertical orientation and a breakaway header type, it efficiently accommodates 14 positions on a 2.54 mm centreline, ensuring a secure fit in your electronic assemblies. The header's through-hole solder design makes installation straightforward, while its durable construction is complemented by a sleek black thermoplastic housing. Designed to operate in high-stress environments, this connector supports operating temperatures from -65 to 105 °C, ensuring reliability under diverse conditions. With compatibility to various industry standards, this product exemplifies both performance and versatility for your connectivity needs, making it a trusted choice for engineers seeking reliable solutions in their projects.

Designed for easy integration into PCB assemblies

Features a breakaway design for flexible configuration

Suitable for fully loaded connector contact load conditions

Utilises nickel and tin underplating for enhanced conductivity

Optimised for through-hole solder termination for strong attachment

Constructed from high-quality thermoplastic for durability

Configured for parallel board-to-board connections

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