TE Connectivity MTA-156 Series Vertical Board PCB Header, 12 Contact(s), 3.96 mm Pitch, 1 Row, Shrouded

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RS-artikelnummer:
480-729
Tillv. art.nr:
1-640445-2
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

MTA-156

Pitch

3.96mm

Current

14.24A

Housing Material

Fibreglass Thermoplastic Polyester

Number of Contacts

12

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Termination Type

Solder

Minimum Operating Temperature

-55°C

Row Pitch

3.96mm

Tail Pin Length

3.18mm

Maximum Operating Temperature

105°C

Mating Pin Length

10.16mm

Standards/Approvals

CSA, UL, VDE

Voltage

60 V

Distrelec Product Id

304-50-123

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is engineered for optimal performance in wire-to-board applications, offering a vertical orientation that efficiently utilises space. Its partial shrouding and robust construction contribute to reliable connections, making it a suitable choice for various electronic designs. Designed for a 12-position configuration, this connector features a 3.96 mm centreline that ensures compatibility with a wide range of components. Crafted from high-grade thermoplastic polyester, it can withstand operating temperatures from -55 to 105 °C, making it versatile for demanding environments. Enhanced with tin plating and nickel underplating, this header ensures superior conductivity while maintaining durability, making it ideal for both commercial and industrial applications.

Supports fully loaded positions to facilitate maximum connection points

Designed for through-hole solder termination, ensuring a secure and permanent fixture

Friction lock mating retention feature enhances connection stability during operation

Natural colour body enhances visual identification and integration into various assemblies

Compatible with industry standards for universal applicability across multiple sectors

Engineering optimised for wave solder processes, accommodating high-temperature assembly methods

Offers alignment features that simplify installation procedures and enhance user experience

Supports CSA, UL, and VDE approvals, ensuring compliance with global electrical standards

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