TE Connectivity AMPMODU Series Right Angle Board PCB Header, 25 Contact(s), 1.27 mm Pitch, 1 Row, Shrouded

Antal (1 rör med 26 enheter)*

2 397,25 kr

(exkl. moms)

2 996,56 kr

(inkl. moms)

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1 +2 397,25 kr92,202 kr

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RS-artikelnummer:
480-266
Distrelec artikelnummer:
304-53-624
Tillv. art.nr:
104074-5
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3.6A

Pitch

1.27mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

25

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Standards/Approvals

RoHS

Voltage

30 V

Uppfyller ej RoHS

COO (Country of Origin):
US
The TE Connectivity PCB Mount Header is designed for right-angle applications within board-to-board configurations, featuring an impressive 25-position layout. Built with a fully shrouded design, it ensures reliable connectivity while maintaining a compact profile. The component is well-suited for a variety of electronic devices, providing an exceptional combination of durability and performance. Its gold contact plating enhances conductivity and reduces wear over time, ensuring long-term reliability even in demanding environments. Ideal for applications requiring robust signal integrity, this header excels in both functionality and ease of use, making it an essential choice for engineers and manufacturers seeking high-quality connectivity solutions.

Designed for board to board connectivity

Fully shrouded header enhances protection against misalignment

Robust gold contact plating for superior conductivity

Right angle orientation simplifies PCB layout

High insulation resistance ensures reliability under voltage stress

Compact design optimises space utilisation on circuit boards

Suitable for a wide range of electronic applications

Wave solder capable ensuring compatibility with automated processes

Nickel underplating for added durability and performance

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