TE Connectivity MTA-156 Series Vertical Board PCB Header, 10 Contact(s), 3.96 mm Pitch, 1 Row, Shrouded

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2 174,60 kr

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RS-artikelnummer:
477-294
Tillv. art.nr:
4-641208-0
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

MTA-156

Product Type

PCB Header

Pitch

3.96mm

Current

14.24A

Housing Material

Fibreglass Thermoplastic Polyester

Number of Contacts

10

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

3.96mm

Termination Type

Solder

Minimum Operating Temperature

-55°C

Tail Pin Length

3.18mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

60 V

Distrelec Product Id

304-50-763

COO (ursprungsland):
CN
The TE Connectivity High-performance PCB Mount Header designed for vertical applications, facilitating seamless wire-to-board connections. Its robust construction ensures durability and reliability, making it an ideal solution for power circuit applications. With a configuration accommodating ten positions and a 3.96 mm centreline, this connector is ideal for compact designs where space is a premium. The gold-plated contacts provide excellent conductivity and resistance to corrosion, enhancing the overall longevity of the connection. Additionally, through-hole soldering allows for straightforward assembly and ensures a secure fit on the PCB, making it perfect for a wide range of electronic devices.

Partially shrouded design protects against accidental disconnection

Constructed from thermoplastic polyester, reinforcing strength and performance

Compatible with various industry standards, ensuring broad applicability

High operating voltage rating supports challenging electrical demands

Matte finish provides enhanced solderability for efficient manufacturing

Friction lock mechanism secures mating connections without additional hardware

Designed for fully loaded configurations, accommodating high current loads

Lightweight structure minimises the overall weight of assembled devices

Wave solder capable, which simplifies mass production processes

Wide operating temperature range ensures functionality in diverse environments

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