TE Connectivity AMPMODU Series Vertical Board PCB Header, 1 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Antal (1 rulle med 25000 enheter)*

17 310,86 kr

(exkl. moms)

21 638,58 kr

(inkl. moms)

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RS-artikelnummer:
476-566
Tillv. art.nr:
5-146871-1
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

1

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Tail Pin Length

2.92mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Distrelec Product Id

304-50-898

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header stands as a key innovation in connector technology, designed for vertical board-to-board applications. Its sleek and compact profile accommodates up to one position, ensuring seamless integration into your electronic designs. The header is engineered with a 2.54 mm centreline, providing reliable connectivity while maximising space efficiency. Crafted for durability, this breakaway connector features gold plating for superior conductivity, making it ideal for high-performance circuits. With a robust through-hole solder termination method, it guarantees a strong mechanical and electrical bond to printed circuit boards, enhancing the reliability of your projects. Whether you are working in industrial, automotive, or consumer electronics, this product brings exceptional value to any assembly process, streamlining development and production timelines with its reliable design.

Compact design optimises space in electronic assemblies

Breakaway header type allows for flexible configurations

Constructed from durable thermoplastic for extended lifespan

Matte finish plating improves solderability and reliability

Designed for board-to-board configurations, enhancing design versatility

Compatible with high operational temperatures for resilient performance

Available in bulk packaging, facilitating large-scale projects

Meets stringent industry standards for safety and compliance

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