TE Connectivity AMPMODU Series Vertical Board PCB Header, 11 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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2 401,75 kr

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3 002,19 kr

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RS-artikelnummer:
475-276
Distrelec artikelnummer:
304-53-436
Tillv. art.nr:
1-215307-1
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Number of Contacts

11

Housing Material

Fibreglass Polyester

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Termination Type

Solder

Maximum Operating Temperature

125°C

Tail Pin Length

3.1mm

Contact Gender

Female

Standards/Approvals

No

COO (Country of Origin):
PL
The TE Connectivity PCB Mount Receptacle is designed for vertical board-to-board applications, facilitating seamless connectivity for critical electronic components. With its 11-position configuration and fully shrouded header type, this receptacle ensures robust connections with minimal risk of misalignment. The advanced gold plating guarantees superior conductivity and durability, making it ideal for demanding environments. Its standard connector profile and black housing material cleverly balance aesthetics with functionality, ensuring it can effortlessly blend into various electronic designs. Built to withstand harsh operating conditions, it's rated for extreme temperatures, providing confidence in its performance across different applications.

The design supports board-to-board connectivity for reliable signal integrity

Fully shrouded header protects contacts from damage and contamination

Constructed with phosphor bronze for excellent strength and conductivity

Features a compact footprint, optimising space on the printed circuit board

Easy installation with through-hole solder termination method

Compatible with a range of AMPMODU series, enhancing system versatility

Durable materials ensure resilience to harsh thermal and mechanical stresses

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