TE Connectivity HV100 Series Vertical Board PCB Header, 4 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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RS-artikelnummer:
475-890
Tillv. art.nr:
829264-4
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

HV100

Current

3A

Pitch

2.54mm

Housing Material

Fibreglass Polyester

Number of Contacts

4

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Maximum Operating Temperature

125°C

Tail Pin Length

3.05mm

Standards/Approvals

UL 94V-0

Distrelec Product Id

304-54-325

COO (Country of Origin):
DE
The TE Connectivity Mount receptacle offers a vertical orientation designed for board-to-board connectivity, featuring four positions and a compact 2.54 mm centreline. Crafted with precision, this connector is perfect for ensuring reliable signal integrity in advanced electronic designs. Its robust construction is enhanced by gold plating, providing excellent corrosion resistance and superior electrical conductivity. Compatible with AMPMODU HV-100/HV-190 series, this receptacle seamlessly integrates into various applications, ensuring a versatile solution for modern engineering challenges. Operating within a wide temperature range, it is engineered to deliver consistent performance even in the most demanding environments. This receptacle is your ideal choice for enhancing connectivity without compromising on quality or performance.

Vertical design optimises space on the PCB

Four-position configuration supports compact applications

Gold plated contacts ensure effective signal transmission

Constructed from durable materials for long-lasting reliability

Compatible with AMPMODU series for versatile integration

Wide operating temperature range suits various applications

Easy through-hole solder termination simplifies assembly

Closed entry housing protects contacts from damage

Lightweight structure reduces overall device weight

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