TE Connectivity AMPMODU Series Vertical Board PCB Header, 4 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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5 734,13 kr

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7 167,66 kr

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RS-artikelnummer:
482-175
Tillv. art.nr:
5-147279-4
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Number of Contacts

4

Housing Material

Glass Filled Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Row Pitch

2.54mm

Termination Type

Surface Mount

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Distrelec Product Id

304-50-899

COO (Country of Origin):
US
The TE Connectivity PCB mount header is designed for vertical board-to-board connections, featuring a robust 4-position layout on a 2.54 mm centreline. Engineered to deliver high reliability, it incorporates a breakaway functionality ideal for streamlined assembly processes. With a surface mount design, this component supports signal applications, making it a preferred choice in various electronic assemblies. The header is crafted from high-quality materials that ensure optimal performance and durability, even in demanding environments. Designed to meet industry standards, it ensures compatibility and compliance while offering a straightforward solution for your PCB connectivity needs.

Vertical orientation optimises space on your PCB

Breakaway design simplifies the assembly process

Nickel underplating enhances contact durability

Surface mount technology offers ease of handling during production

Low-temperature solder capability allows compatibility with a variety of soldering applications

Signal application focus ensures reliable communication between circuit boards

Black colour ensures clear visibility of solder joints

Parallel board-to-board configuration accommodates diverse layout requirements

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