TE Connectivity AMPMODU Series Vertical Board PCB Header, 2 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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RS-artikelnummer:
473-602
Distrelec artikelnummer:
304-50-876
Tillv. art.nr:
5-146256-1
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Number of Contacts

2

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold Plated

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Tail Pin Length

3.05mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is a robust connector designed specifically for vertical, board-to-board applications, ensuring a secure electrical connection between circuit boards. With its breakaway feature and gold plating, this connector not only offers superior conductivity but also allows for easy integration into various PCB layouts. Engineered to handle diverse applications, it boasts a compact design featuring a 2.54 mm centreline, making it ideal for densely populated circuit boards. Its high operating voltage rating of 30 VAC ensures reliable performance in demanding conditions, while the wide operating temperature range ensures versatility across various environments. Through its meticulous construction from durable thermoplastic, this connector promises longevity and consistent performance, catering to the needs of modern connectivity.

Compact design optimises circuit board space

Breakaway feature enhances flexibility in assembly

Gold plating ensures superior conductivity and corrosion resistance

Designed for reliable board-to-board connections

Robust thermal characteristics support high operating temperatures

Engineered for high-density PCB applications

Available in a reliable two-position layout for streamlined connectivity

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