TDK 10nF Multilayer Ceramic Capacitor MLCC, 450V dc V, ±10% , SMD
- RS-artikelnummer:
- 179-5599
- Tillv. art.nr:
- CGA4F4X7T2W103K085AE
- Tillverkare / varumärke:
- TDK
Mängdrabatt möjlig
Antal (1 förpackning med 100 enheter)*
131,00 kr
(exkl. moms)
164,00 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
Tillfälligt slut
- Leverans från den 30 mars 2026
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Enheter | Per enhet | Per förpackning* |
|---|---|---|
| 100 - 400 | 1,31 kr | 131,00 kr |
| 500 - 900 | 1,277 kr | 127,70 kr |
| 1000 - 2400 | 1,245 kr | 124,50 kr |
| 2500 - 4900 | 1,21 kr | 121,00 kr |
| 5000 + | 1,179 kr | 117,90 kr |
*vägledande pris
- RS-artikelnummer:
- 179-5599
- Tillv. art.nr:
- CGA4F4X7T2W103K085AE
- Tillverkare / varumärke:
- TDK
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | TDK | |
| Capacitance | 10nF | |
| Voltage | 450V dc | |
| Package/Case | 0805 (2012M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7T | |
| Tolerance | ±10% | |
| Dimensions | 2 x 1.25 x 0.85mm | |
| Automotive Standard | AEC-Q200 | |
| Length | 2mm | |
| Depth | 1.25mm | |
| Height | 0.85mm | |
| Series | CGA | |
| Suppression Class | Class 2 | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +125°C | |
| Välj alla | ||
|---|---|---|
Brand TDK | ||
Capacitance 10nF | ||
Voltage 450V dc | ||
Package/Case 0805 (2012M) | ||
Mounting Type Surface Mount | ||
Dielectric X7T | ||
Tolerance ±10% | ||
Dimensions 2 x 1.25 x 0.85mm | ||
Automotive Standard AEC-Q200 | ||
Length 2mm | ||
Depth 1.25mm | ||
Height 0.85mm | ||
Series CGA | ||
Suppression Class Class 2 | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +125°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
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