TDK 10nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
- RS-artikelnummer:
- 179-5540
- Tillv. art.nr:
- CGA4J3X7R2E103K125AE
- Tillverkare / varumärke:
- TDK
Mängdrabatt möjlig
Antal (1 förpackning med 100 enheter)*
51,10 kr
(exkl. moms)
63,90 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
I lager
- Dessutom levereras 800 enhet(er) från den 22 december 2025
- Dessutom levereras 2 900 enhet(er) från den 29 december 2025
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Enheter | Per enhet | Per förpackning* |
|---|---|---|
| 100 - 400 | 0,511 kr | 51,10 kr |
| 500 - 900 | 0,426 kr | 42,60 kr |
| 1000 + | 0,341 kr | 34,10 kr |
*vägledande pris
- RS-artikelnummer:
- 179-5540
- Tillv. art.nr:
- CGA4J3X7R2E103K125AE
- Tillverkare / varumärke:
- TDK
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | TDK | |
| Capacitance | 10nF | |
| Voltage | 250V dc | |
| Package/Case | 0805 (2012M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7R | |
| Tolerance | ±10% | |
| Dimensions | 2 x 1.25 x 1.25mm | |
| Length | 2mm | |
| Automotive Standard | AEC-Q200 | |
| Depth | 1.25mm | |
| Height | 1.25mm | |
| Series | CGA | |
| Suppression Class | Class 2 | |
| Maximum Operating Temperature | +125°C | |
| Minimum Operating Temperature | -55°C | |
| Välj alla | ||
|---|---|---|
Brand TDK | ||
Capacitance 10nF | ||
Voltage 250V dc | ||
Package/Case 0805 (2012M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±10% | ||
Dimensions 2 x 1.25 x 1.25mm | ||
Length 2mm | ||
Automotive Standard AEC-Q200 | ||
Depth 1.25mm | ||
Height 1.25mm | ||
Series CGA | ||
Suppression Class Class 2 | ||
Maximum Operating Temperature +125°C | ||
Minimum Operating Temperature -55°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
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