Specifikationer

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Produktdetaljer

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Välj alla	Attribut	Värde
	Varumärke	Amphenol Communications Solutions
	IC-sockeltyp	Prototypsockel
	Kapseltyp	Ytmontering
	Produkttyp	IC-sockel
	Antal kontakter	400
	Ström	450mA
	Antal rader	8
	Spänning	200 V
	Delning	1.27mm
	Orientering	Rak
	Kontaktmaterial	Kopparlegering
	Kontaktplätering	Guld
	Radpitch	1.27mm
	Enhet monteringstyp	Yta
	Termineringstyp	Lödning
	Minsta arbetsstemperatur	-55°C
	Typ av sockelmontering	Yta
	Maximal arbetstemperatur	85°C
	Standarder/godkännanden	No
	Serie	Meg-Array
	Husmaterial	Flytande kristallpolymer

	Välj alla
	Varumärke Amphenol Communications Solutions
	IC-sockeltyp Prototypsockel
	Kapseltyp Ytmontering
	Produkttyp IC-sockel
	Antal kontakter 400
	Ström 450mA
	Antal rader 8
	Spänning 200 V
	Delning 1.27mm
	Orientering Rak
	Kontaktmaterial Kopparlegering
	Kontaktplätering Guld
	Radpitch 1.27mm
	Enhet monteringstyp Yta
	Termineringstyp Lödning
	Minsta arbetsstemperatur -55°C
	Typ av sockelmontering Yta
	Maximal arbetstemperatur 85°C
	Standarder/godkännanden No
	Serie Meg-Array
	Husmaterial Flytande kristallpolymer

High density, high speed, discrete contact, array connector

Flexible ground distribution optimizes high speed signal integrity

10Gb/s differential pair performance with under 1% cross-talk

28Gb/s high speed performance documented for 4 mm and 6 mm stack height

Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market

1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space

Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility

6 PCB Stack heights: 4 mm to 14mm

8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform

High density standard BGA attachment lower assembly costs by using standard SMT processes

BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage

Patented BGA contact attachment preserves solder ball positioning

Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability

Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options

400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free

Amphenol Communications Solutions IC-sockel, 1.27 mm Avstånd, 400-polen Yta, husmaterial Flytande kristallpolymer,

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