Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, TSSOP 20 to DIP 20
- RS-artikelnummer:
- 741-9417
- Tillv. art.nr:
- W9576RC
- Tillverkare / varumärke:
- Winslow
Mängdrabatt möjlig
Antal (1 förpackning med 5 enheter)*
645,55 kr
(exkl. moms)
806,95 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
I lager
- 45 enhet(er) är redo att levereras
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Enheter | Per enhet | Per förpackning* |
|---|---|---|
| 5 - 120 | 129,11 kr | 645,55 kr |
| 125 - 370 | 116,188 kr | 580,94 kr |
| 375 - 995 | 103,264 kr | 516,32 kr |
| 1000 - 1995 | 90,384 kr | 451,92 kr |
| 2000 + | 83,932 kr | 419,66 kr |
*vägledande pris
- RS-artikelnummer:
- 741-9417
- Tillv. art.nr:
- W9576RC
- Tillverkare / varumärke:
- Winslow
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Winslow | |
| Pitch | 0.5 mm, 2.54 mm | |
| End 1 | TSSOP 20 | |
| End 2 | DIP 20 | |
| End 1 Number of Contacts | 20 | |
| End 2 Number of Contacts | 20 | |
| End 1 Type | TSSOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Välj alla | ||
|---|---|---|
Brand Winslow | ||
Pitch 0.5 mm, 2.54 mm | ||
End 1 TSSOP 20 | ||
End 2 DIP 20 | ||
End 1 Number of Contacts 20 | ||
End 2 Number of Contacts 20 | ||
End 1 Type TSSOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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