Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, TSOP 48 to DIP 48
- RS-artikelnummer:
- 741-9458
- Tillv. art.nr:
- W13014RC
- Tillverkare / varumärke:
- Winslow
Mängdrabatt möjlig
Antal (1 enhet)*
429,95 kr
(exkl. moms)
537,44 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
Tillfälligt slut
- Leverans från den 09 februari 2026
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Enheter | Per enhet |
|---|---|
| 1 - 9 | 429,95 kr |
| 10 - 24 | 365,34 kr |
| 25 - 49 | 343,84 kr |
| 50 - 99 | 322,45 kr |
| 100 + | 300,94 kr |
*vägledande pris
- RS-artikelnummer:
- 741-9458
- Tillv. art.nr:
- W13014RC
- Tillverkare / varumärke:
- Winslow
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Winslow | |
| Pitch | 0.5 mm, 2.54 mm | |
| End 1 | TSOP 48 | |
| End 2 | DIP 48 | |
| End 1 Number of Contacts | 48 | |
| End 2 Number of Contacts | 48 | |
| End 1 Type | TSOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Välj alla | ||
|---|---|---|
Brand Winslow | ||
Pitch 0.5 mm, 2.54 mm | ||
End 1 TSOP 48 | ||
End 2 DIP 48 | ||
End 1 Number of Contacts 48 | ||
End 2 Number of Contacts 48 | ||
End 1 Type TSOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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