TE Connectivity 2.54mm Pitch Straight 20 Way, Through Hole Ladder IC Dip Socket, 1A
- RS-artikelnummer:
- 186-4808
- Tillv. art.nr:
- 1-2199298-6
- Tillverkare / varumärke:
- TE Connectivity
Antal (1 rör med 2400 enheter)*
8 570,40 kr
(exkl. moms)
10 713,60 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
Tillfälligt slut
- Leverans från den 06 april 2026
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Enheter | Per enhet | Per Rør* |
|---|---|---|
| 2400 + | 3,571 kr | 8 570,40 kr |
*vägledande pris
- RS-artikelnummer:
- 186-4808
- Tillv. art.nr:
- 1-2199298-6
- Tillverkare / varumärke:
- TE Connectivity
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | TE Connectivity | |
| Number of Contacts | 20 | |
| Mounting Type | Through Hole | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Ladder | |
| Termination Method | Solder | |
| Contact Plating | Tin | |
| Current Rating | 1A | |
| Orientation | Straight | |
| Length | 25.4mm | |
| Width | 10mm | |
| Depth | 5.1mm | |
| Dimensions | 25.4 x 10 x 5.1mm | |
| Voltage Rating | 250 V ac/dc | |
| Minimum Operating Temperature | -40°C | |
| Contact Material | Phosphor Bronze | |
| Housing Material | Glass Filled PBT, Thermoplastic | |
| Maximum Operating Temperature | +105°C | |
| Välj alla | ||
|---|---|---|
Brand TE Connectivity | ||
Number of Contacts 20 | ||
Mounting Type Through Hole | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Ladder | ||
Termination Method Solder | ||
Contact Plating Tin | ||
Current Rating 1A | ||
Orientation Straight | ||
Length 25.4mm | ||
Width 10mm | ||
Depth 5.1mm | ||
Dimensions 25.4 x 10 x 5.1mm | ||
Voltage Rating 250 V ac/dc | ||
Minimum Operating Temperature -40°C | ||
Contact Material Phosphor Bronze | ||
Housing Material Glass Filled PBT, Thermoplastic | ||
Maximum Operating Temperature +105°C | ||
Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs. Termination options include through hole and surface mounting, four-finger and dual leaf contacts, as well as a variety of plating options.
6 to 48 positions
Precision four-finger inner contacts or dual leaf contacts are optional
Open frame and closed frame housings
End-to-end and side-to-side stackable
Available with a variety of plating options
Quick IC mating/unmating
Easy field IC replacement
Avoidance of IC overheating during soldering
Flexibility of system upgrade
Large portfolio offers product closest to your need
Applications
Industrial controls
Intelligent buildings
Medical devices
Military
Other embedded systems
Precision four-finger inner contacts or dual leaf contacts are optional
Open frame and closed frame housings
End-to-end and side-to-side stackable
Available with a variety of plating options
Quick IC mating/unmating
Easy field IC replacement
Avoidance of IC overheating during soldering
Flexibility of system upgrade
Large portfolio offers product closest to your need
Applications
Industrial controls
Intelligent buildings
Medical devices
Military
Other embedded systems
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