STMicroelectronics RF Transceiver, 6-Pin Bumpless CSP
- RS-artikelnummer:
- 192-3828
- Tillv. art.nr:
- MLPF-WB55-01E3
- Tillverkare / varumärke:
- STMicroelectronics
Antal (1 rulle med 5000 enheter)*
9 355,00 kr
(exkl. moms)
11 695,00 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
Tillfälligt slut
- Leverans från den 27 april 2026
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Enheter | Per enhet | Per rulle* |
|---|---|---|
| 5000 + | 1,871 kr | 9 355,00 kr |
*vägledande pris
- RS-artikelnummer:
- 192-3828
- Tillv. art.nr:
- MLPF-WB55-01E3
- Tillverkare / varumärke:
- STMicroelectronics
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | STMicroelectronics | |
| Product Type | RF Transceiver | |
| Technology | IPD on Non-Conductive Glass Substrate | |
| Sub Type | RF Transceiver | |
| Package Type | Bumpless CSP | |
| Pin Count | 6 | |
| Mount Type | Surface | |
| Operating Band 1 Frequency | 2500MHz | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Series | MLPF-WB55 | |
| Width | 1.6 mm | |
| Length | 1.63mm | |
| Standards/Approvals | ECOPACK2 | |
| Number of Operating Bands | 1 | |
| Automotive Standard | No | |
| Välj alla | ||
|---|---|---|
Brand STMicroelectronics | ||
Product Type RF Transceiver | ||
Technology IPD on Non-Conductive Glass Substrate | ||
Sub Type RF Transceiver | ||
Package Type Bumpless CSP | ||
Pin Count 6 | ||
Mount Type Surface | ||
Operating Band 1 Frequency 2500MHz | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Series MLPF-WB55 | ||
Width 1.6 mm | ||
Length 1.63mm | ||
Standards/Approvals ECOPACK2 | ||
Number of Operating Bands 1 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- CN
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55xx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
Integrated impedance matching to STM32WB55Cx and STM32WB55Rx
LGA footprint compatible
50 Ω nominal impedance on antenna side
Deep rejection harmonics filter
Low insertion loss
Small footprint
Low thickness ≤ 450 μm
High RF performance
RF BOM and area reduction
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