STMicroelectronics 3 phase complete inverter with STSPIN32G0601Q controller 3-Phase Inverter for STSPIN32G0601Q for
- RS-artikelnummer:
- 136-273
- Tillv. art.nr:
- EVSPIN32G06Q1S3
- Tillverkare / varumärke:
- STMicroelectronics
Antal (1 enhet)*
1 037,68 kr
(exkl. moms)
1 297,10 kr
(inkl. moms)
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Enheter | Per enhet |
|---|---|
| 1 + | 1 037,68 kr |
*vägledande pris
- RS-artikelnummer:
- 136-273
- Tillv. art.nr:
- EVSPIN32G06Q1S3
- Tillverkare / varumärke:
- STMicroelectronics
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | STMicroelectronics | |
| Power Management Function | 3-Phase Inverter | |
| For Use With | PMSMs Motors | |
| Kit Classification | Evaluation Board | |
| Featured Device | STSPIN32G0601Q | |
| Kit Name | 3 phase complete inverter with STSPIN32G0601Q controller | |
| Välj alla | ||
|---|---|---|
Brand STMicroelectronics | ||
Power Management Function 3-Phase Inverter | ||
For Use With PMSMs Motors | ||
Kit Classification Evaluation Board | ||
Featured Device STSPIN32G0601Q | ||
Kit Name 3 phase complete inverter with STSPIN32G0601Q controller | ||
- COO (Country of Origin):
- IT
The STMicroelectronics board is a 3-phase inverter featuring the STSPIN32G0601 controller with an integrated 600 V gate driver and Cortex-M0+ STM32 MCU. It is designed for high-performance motor control with three-shunt sensing for Field-Oriented Control. The board accommodates a broad input voltage range and utilizes a flyback power supply to provide necessary voltages. Firmware development and debugging are facilitated through STLINK tools with SWD and UART connectivity.
Input voltage range from 35 VAC to 280 VAC and 50 VDC to 400 VDC
Three-shunt current sensing supporting FOC with both sensored and sensorless modes
Overcurrent threshold set to 3.5 A peak
Dual package footprint options for IGBT or MOSFET in DPAK or PowerFlat 8x8 HV
Three-shunt current sensing supporting FOC with both sensored and sensorless modes
Overcurrent threshold set to 3.5 A peak
Dual package footprint options for IGBT or MOSFET in DPAK or PowerFlat 8x8 HV
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