Adaptive Peltier Module, 37.9W, 3.9A, 15.7V, 30 x 30mm
- RS-artikelnummer:
- 490-1519
- Tillv. art.nr:
- ETH-127-10-13-S-RS
- Tillverkare / varumärke:
- Adaptive
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Enheter | Per enhet |
|---|---|
| 1 - 4 | 457,17 kr |
| 5 - 9 | 434,34 kr |
| 10 - 24 | 420,56 kr |
| 25 - 99 | 402,30 kr |
| 100 + | 356,61 kr |
*vägledande pris
- RS-artikelnummer:
- 490-1519
- Tillv. art.nr:
- ETH-127-10-13-S-RS
- Tillverkare / varumärke:
- Adaptive
Specifikationer
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Lagstiftning och ursprungsland
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Adaptive | |
| Maximum Cooling Capacity | 37.9W | |
| Maximum Temperature Difference | +74K | |
| Maximum Current | 3.9A | |
| Maximum Voltage | 15.7V | |
| Active Area | 30 x 30mm | |
| Active Area Length | 30mm | |
| Active Area Thickness | 3.6mm | |
| Active Area Width | 30mm | |
| Välj alla | ||
|---|---|---|
Brand Adaptive | ||
Maximum Cooling Capacity 37.9W | ||
Maximum Temperature Difference +74K | ||
Maximum Current 3.9A | ||
Maximum Voltage 15.7V | ||
Active Area 30 x 30mm | ||
Active Area Length 30mm | ||
Active Area Thickness 3.6mm | ||
Active Area Width 30mm | ||
- COO (Country of Origin):
- CN
Thermoelectric Cooler Modules, Adaptive
The Thermoelectric modules utilise the Peltier phenomenon principle to pump heat when voltage is applied.
Effective cooling power from mW to a hundred of Watts
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Thermoelectric Modules - Peltier Effect
A range of semiconductor thermoelectric devices working on the Peltier effect. When supplied with a suitable electric current, they can either cool or heat. When subject to an externally applied temperature gradient these devices will generate a small amount of electrical power.The larger devices can be used for cooling or controlling the temperature of sub-assemblies. The small size of the mini module makes it ideally suited for cooling miniature electronic components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors.,Alternatively, it may be used to minimise the effects of temperature coefficients on oscillator stability, reference voltages, amplifier offsets etc. by providing temperature control.
Solid-state long term stability
Generates no acoustic noise
Generates no acoustic noise
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