Adaptive Peltier Module, 10.4W, 2.2A, 7.6V, 12 x 25mm
- RS-artikelnummer:
- 490-1301
- Tillv. art.nr:
- ET-063-08-15-RS
- Tillverkare / varumärke:
- Adaptive
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Enheter | Per enhet |
|---|---|
| 1 - 4 | 475,28 kr |
| 5 - 9 | 451,47 kr |
| 10 - 24 | 437,25 kr |
| 25 - 99 | 418,21 kr |
| 100 + | 370,61 kr |
*vägledande pris
- RS-artikelnummer:
- 490-1301
- Tillv. art.nr:
- ET-063-08-15-RS
- Tillverkare / varumärke:
- Adaptive
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Adaptive | |
| Maximum Cooling Capacity | 10.4W | |
| Maximum Temperature Difference | +74K | |
| Maximum Current | 2.2A | |
| Maximum Voltage | 7.6V | |
| Active Area | 12 x 25mm | |
| Active Area Length | 12mm | |
| Active Area Thickness | 3.8mm | |
| Active Area Width | 25mm | |
| Välj alla | ||
|---|---|---|
Brand Adaptive | ||
Maximum Cooling Capacity 10.4W | ||
Maximum Temperature Difference +74K | ||
Maximum Current 2.2A | ||
Maximum Voltage 7.6V | ||
Active Area 12 x 25mm | ||
Active Area Length 12mm | ||
Active Area Thickness 3.8mm | ||
Active Area Width 25mm | ||
- COO (Country of Origin):
- CN
Thermoelectric Cooler Modules, Adaptive
The Thermoelectric modules utilise the Peltier phenomenon principle to pump heat when voltage is applied.
Effective cooling power from mW to a hundred of Watts
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Thermoelectric Modules - Peltier Effect
A range of semiconductor thermoelectric devices working on the Peltier effect. When supplied with a suitable electric current, they can either cool or heat. When subject to an externally applied temperature gradient these devices will generate a small amount of electrical power.The larger devices can be used for cooling or controlling the temperature of sub-assemblies. The small size of the mini module makes it ideally suited for cooling miniature electronic components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors.,Alternatively, it may be used to minimise the effects of temperature coefficients on oscillator stability, reference voltages, amplifier offsets etc. by providing temperature control.
Solid-state long term stability
Generates no acoustic noise
Generates no acoustic noise