Molex PMC Mezzanine Series Straight Surface Mount Edge Connector, 64-Contact, 2-Row, 1mm Pitch, Solder Termination
- RS-artikelnummer:
- 447-7202
- Tillv. art.nr:
- 71439-1164
- Tillverkare / varumärke:
- Molex
Antal (1 enhet)*
88,60 kr
(exkl. moms)
110,75 kr
(inkl. moms)
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- 3 enhet(er) är redo att levereras
- Dessutom levereras 23 enhet(er) från den 30 december 2025
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Enheter | Per enhet |
|---|---|
| 1 + | 88,60 kr |
*vägledande pris
- RS-artikelnummer:
- 447-7202
- Tillv. art.nr:
- 71439-1164
- Tillverkare / varumärke:
- Molex
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Molex | |
| Number of Contacts | 64 | |
| Number of Rows | 2 | |
| Pitch | 1mm | |
| Type | Board to Board | |
| Mounting Type | Surface Mount | |
| Body Orientation | Straight | |
| Termination Method | Solder | |
| Current Rating | 12A | |
| Voltage Rating | 100 V | |
| Series | PMC Mezzanine | |
| Contact Material | Bronze | |
| Series Number | 71439 | |
| Välj alla | ||
|---|---|---|
Brand Molex | ||
Number of Contacts 64 | ||
Number of Rows 2 | ||
Pitch 1mm | ||
Type Board to Board | ||
Mounting Type Surface Mount | ||
Body Orientation Straight | ||
Termination Method Solder | ||
Current Rating 12A | ||
Voltage Rating 100 V | ||
Series PMC Mezzanine | ||
Contact Material Bronze | ||
Series Number 71439 | ||
- COO (Country of Origin):
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
Approvals
UL 94 V-0
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