Samtec SSW Series Straight Through Hole PCB Socket, 38-Contact, 2 Row, 2.54 mm Pitch Solder

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79,94 kr

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99,92 kr

(inkl. moms)

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RS-artikelnummer:
198-1652
Tillv. art.nr:
SSW-119-01-G-D
Tillverkare / varumärke:
Samtec
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Brand

Samtec

Number of Contacts

38

Product Type

PCB Socket

Sub Type

Solder Tail

Number of Rows

2

Pitch

2.54mm

Current

4.7A

Termination Type

Solder

Housing Material

Liquid Crystal Polymer

Mount Type

Through Hole

Orientation

Straight

Connector System

Board-to-Board

Voltage

465 V

Series

SSW

Minimum Operating Temperature

-55°C

Row Pitch

2.5mm

Contact Plating

Gold or Tin over Nickel

Maximum Operating Temperature

125°C

Contact Material

Phosphor Bronze

Contact Gender

Female

Standards/Approvals

No

Samtec SSW Series PCB Socket, 2.54 mm Pitch, Through-Hole Mounting - SSW-119-01-G-D


This PCB socket from Samtec is a straight, through-hole socket with 38 contacts arranged in 2 rows. With a pitch of 2.54mm, it belongs to the SSW series. It is designed to meet high standards of quality and performance.

Features & Benefits


• Straight orientation for easy installation on PCBs

• Through-hole mounting type for secure connection

• 38 contacts arranged in 2 rows for enhanced connectivity

• 2.54mm pitch allows for precise placement on the PCB

• Part of the SSW series for reliable performance

Applications


• Ideal for use in electronic devices requiring secure PCB connections

• Suitable for applications in the automation industry that demand high-performance components

Can it be used in high-traffic electronic applications?


Yes, this PCB socket is designed to withstand high-traffic environments, making it suitable for demanding electronic applications.

Will it provide a secure connection on the PCB?


Yes, the through-hole mounting type ensures a stable and reliable connection on the PCB.

Is it compatible with other components in the SSW series?


Yes, this PCB socket is part of the SSW series and can be seamlessly integrated with other components in the same series.

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