Molex 50555 Series Vertical Board PCB Socket, 40-Contact, 2 Row, 0.4 mm Pitch Surface Mount

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Antal (1 rulle med 7000 enheter)*

61 850,34 kr

(exkl. moms)

77 312,92 kr

(inkl. moms)

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RS-artikelnummer:
520-708
Distrelec artikelnummer:
304-56-577
Tillv. art.nr:
505550-4020
Tillverkare / varumärke:
Molex
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Brand

Molex

Number of Contacts

40

Product Type

PCB Socket

Sub Type

PCB Receptacle

Number of Rows

2

Pitch

0.4mm

Current

0.3A

Housing Material

Liquid Crystal Polymer

Termination Type

Surface Mount

Mount Type

Board

Orientation

Vertical

Stacking Height

0.8mm

Voltage

50 Vrms

Series

50555

Minimum Operating Temperature

-40°C

Row Pitch

0.4mm

Contact Material

Copper Alloy

Contact Plating

Gold

Maximum Operating Temperature

85°C

Standards/Approvals

IEC 61249-2-21, EU 2015/863

COO (Country of Origin):
JP
The TE Connectivity Board-to-Board Receptacle represents a sophisticated innovation in interconnect solutions, tailored for applications demanding precision and reliability. With a compact 0.40mm pitch design, this connector enhances space efficiency without compromising performance. Designed for board-to-board applications, it facilitates seamless connections with its 40-circuit capacity, ensuring robust data integrity and electrical performance. Its black resin finish and surface mount termination style are engineered to withstand operational temperatures from -40° to +85°C, making it suitable for diverse environments. Notably, the product is non-recommended for new designs, yet it remains a testament to advanced engineering, showcasing premium materials and meticulous attention to durability with a maximum of 30 mating cycles.

Designed to support high-density applications with maximum reliability

Offers a vertical orientation for easy integration into existing systems

Includes a robust packaging type of embossed tape on reel for safe handling

Constructed from high-quality liquid crystal polymer for enhanced thermal resistance

Equipped with a PCB retention feature ensuring stable mounting within devices

Utilises a copper alloy construction with gold plating to minimise contact resistance

Incorporates a lock to mating part mechanism for secure connections

Achieves compliance with multiple environmental standards enhancing its market flexibility

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