TE Connectivity 53539 Series Vertical Board PCB Socket, 80-Contact, 0.8 mm Pitch Surface Mount

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55 500,48 kr

(exkl. moms)

69 375,60 kr

(inkl. moms)

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RS-artikelnummer:
481-101
Distrelec artikelnummer:
304-50-976
Tillv. art.nr:
5353999-3
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Socket

Number of Contacts

80

Sub Type

PCB Receptacle

Current

0.5A

Pitch

0.8mm

Termination Type

Surface Mount

Housing Material

Matt

Mount Type

Board

Orientation

Vertical

Stacking Height

8mm

Connector System

Board-to-Board

Voltage

100 V

Series

53539

Minimum Operating Temperature

-40°C

Row Pitch

0.8mm

Contact Gender

Female

Contact Material

Copper Alloy

Contact Plating

Gold

Maximum Operating Temperature

125°C

Standards/Approvals

UL 94V-0, EU RoHS Directive 2011/65/EU, China RoHS 2 Directive MIIT Order No 32, 2016, EU ELV Directive 2000/53/EC

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Receptacle is designed for vertical board-to-board connectivity, offering a reliable solution for applications requiring high-density connections. The receptacle accommodates 80 positions with a compact .8 mm centreline, making it ideal for contemporary electronic environments. Crafted for surface mount technology, it features a robust construction to support effective signal transmission while resisting mechanical strain. This connector boasts gold plating for enhanced conductivity, ensuring consistent performance in various operating conditions. With an impressive insulation resistance of 2 MΩ and a dielectric withstanding voltage rating of up to 500 VAC, this product demonstrates exceptional electrical robustness.

Designed for seamless board-to-board interconnections

Stackable design enables efficient space management

Boasts high insulation resistance for reliable performance

Crafted from durable materials for longevity in demanding conditions

Features a matte finish for enhanced aesthetic appeal

Supports a wide operating temperature range, ensuring versatility across applications

Utilises gold plating in contact areas for superior electrical conductivity

Configured for parallel board-to-board alignment, facilitating easy integration

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