TE Connectivity CHAMP Series Vertical Board Mount PCB Header, 160-Contact, 1.27mm Pitch, Solder, Through Hole

The TE Connectivity PCB Mount Receptacle from TE Connectivity is engineered to ensure robust performance in board-to-board connectivity applications. Featuring a vertical orientation and a high-density configuration of 160 positions, this component is ideal for compact electronic designs where space is a premium. With a centerline pitch of 1.27 mm, it maximizes space efficiency while maintaining reliability in electrical connections. Its construction with gold flash plating enhances durability and conductivity, making it suitable for a variety of environments. Designed specifically for through-hole solder termination, this receptacle provides dependable mechanical and electrical stability, ensuring a secure connection throughout its operating life. Its extensive operating temperature range of -55 to 85 °C indicates the versatility and resilience of this product, making it an excellent choice for diverse applications in electronics.

Utilizes a standard connector profile for easy integration
PCB mount orientation facilitates straightforward assembly
Designed for board-to-board connectivity to enhance design flexibility
Incorporates polarized mating alignment features for simplified connection
Constructed with phosphor bronze for superior contact reliability
Matte housing material enhances visual aesthetics while ensuring performance
Compatible with wave solder processes for efficient manufacturing
Utilizes a PCB retention feature to provide secure attachment