Molex 50506 Series Vertical Board PCB Socket, 20-Contact, 2 Row, 0.35 mm Pitch Surface Mount

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Antal (1 rulle med 8000 enheter)*

44 719,73 kr

(exkl. moms)

55 899,66 kr

(inkl. moms)

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RS-artikelnummer:
473-295
Distrelec artikelnummer:
304-62-402
Tillv. art.nr:
505066-2022
Tillverkare / varumärke:
Molex
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Brand

Molex

Product Type

PCB Socket

Number of Contacts

20

Number of Rows

2

Sub Type

PCB Receptacle

Current

0.3A

Pitch

0.35mm

Housing Material

Liquid Crystal Polymer

Termination Type

Surface Mount

Mount Type

Board

Orientation

Vertical

Stacking Height

0.6mm

Voltage

50 Vrms

Series

50506

Minimum Operating Temperature

-40°C

Row Pitch

0.35mm

Contact Plating

Gold

Contact Material

Copper Alloy

Maximum Operating Temperature

85°C

Standards/Approvals

IPC 1752A Class D, chemSHERPA, IEC 61249-2-21, IEC-62474, IPC 1752A Class C

COO (Country of Origin):
JP
The TE Connectivity Board-to-Board Receptacle is engineered to deliver reliable performance in space-constrained applications. With a precise 0.35mm pitch and minimal mated height, it is ideal for modern electronic designs requiring compact solutions. The component boasts 20 circuits to facilitate efficient connectivity, making it an excellent choice for various electronic assemblies. Its robust construction employs high-quality copper alloy and liquid crystal polymer materials, ensuring durability and longevity. The product is compliant with the latest environmental standards, providing assurance for low-halogens and restricted substances, making it suitable for global markets.

Designed for vertical orientation, enhancing space efficiency

Utilises gold plating for improved signal integrity

Surface mount termination style optimises PCB space

Employed in a variety of board-to-board applications

Offers excellent mating durability for reliable connections

Light-weight design ensures minimal impact on overall product weight

Features a pitch of 0.35mm at both the mating and termination interface

No glow-wire capability enhances safety in critical applications

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