Specifikationer

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Välj alla	Attribut	Värde
	Brand	Amphenol Communications Solutions
	Product Type	PCB Header
	Series	BergStak
	Pitch	0.8mm
	Current	800mA
	Number of Contacts	100
	Housing Material	Liquid Crystal Polymer
	Number of Rows	2
	Orientation	Right Angle
	Shrouded/Unshrouded	Shrouded
	Connector System	Board-to-Board
	Mount Type	Surface
	Contact Plating	Gold
	Contact Material	Brass
	Termination Type	Solder
	Minimum Operating Temperature	-40°C
	Maximum Operating Temperature	125°C
	Standards/Approvals	No
	Voltage	100 V

	Välj alla
	Brand Amphenol Communications Solutions
	Product Type PCB Header
	Series BergStak
	Pitch 0.8mm
	Current 800mA
	Number of Contacts 100
	Housing Material Liquid Crystal Polymer
	Number of Rows 2
	Orientation Right Angle
	Shrouded/Unshrouded Shrouded
	Connector System Board-to-Board
	Mount Type Surface
	Contact Plating Gold
	Contact Material Brass
	Termination Type Solder
	Minimum Operating Temperature -40°C
	Maximum Operating Temperature 125°C
	Standards/Approvals No
	Voltage 100 V

0.8mm board to board plug assembly Data Sheet

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COO (Country of Origin):: CN

0.8mm Bergstak® Series

These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.

Blade-on-beam contacts allow ’peeling’ and prevent ’stubbing’

The Bergstak® system from FCI are high density parallel board to board connectors which can be configured to various PCB stack heights. These Bergstak® connectors are polarized, have generous lead-in angles with precise contact positioning ensuring precise mating alignment and reliability.

Amphenol Communications Solutions BergStak Series Right Angle Surface PCB Header, 100 Contact(s), 0.8 mm Pitch, 2 Row,

0.8mm Bergstak® Series

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